Abstract
This study demonstrates that applying artificial intelligence (AI) to chemical-mechanical planarization (CMP) process control significantly reduces rework rates and enhances manufacturing efficiency. We propose a hierarchical AI CMP controller featuring an auto-tuning capability. This integrated hierarchical reinforcement learning (iHRL) framework is designed to mitigate CMP variations arising from removal rate decay and pattern density fluctuations. The iHRL agent utilizes a structured wafer-to-wafer and lot-to-lot control architecture. Results demonstrate that the self-learning auto-tuning mechanism effectively minimizes the CMP rework rate. Furthermore, comprehensive simulations indicate that the proposed controller enhances average manufacturing efficiency by more than double digits compared to the conventional run-to-run controller.
Keywords: semiconductor manufacturing; chemical mechanical planarization; artificial intelligence
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